First HSPA+ 20 Mbps Call Made by Qualcomm

Qualcomm has completed the world’s first data call using High-Speed Packet Access Plus (HSPA+) network technology.  The call achieved a data transfer rate of more than 20 Mbps in a 5 MHz channel.  HSPA+ will allow operators to double the data and triple the voice capacity of their networks compared to current HSPA deployments.  The successful data throughput was achieved on Qualcomm’s MDM8200(TM) product, the industry’s first chipset solution for HSPA+. 

The latest evolution of WCDMA technology, HSPA+ Release 7, will offer downlink data transfer rates of up to 28 Mbps and uplink rates of up to 11 Mbps.  Future HSPA+ releases are expected to support downlink peak rates of 42-84 Mbps and uplink peak rates of 23 Mbps by using a variety of advanced techniques, including multiple carriers for transferring data.  HSPA+ is backward compatible with prior generations of WCDMA and does not require new spectrum for deployment.  Operators can leverage their existing network and spectrum resources to offer next-generation wireless bandwidth and performance.

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